Santa Ana, CA (April 10, 2023): Duplo USA Corporation, the leading provider of innovating finishing solutions, will be on the show floor at the 2023 Dscoop Edge World Expo showcasing its key products for B2 output. Inside the Duplo booth #541, HP Digital Press users will have the opportunity to see live demonstrations of the new DC-746 B2 Slitter/Cutter/Creaser, designed for finishing oversized applications, and the DSM-1000 B2 Platen Die Cutter, ideal for producing packaging on demand.
“Duplo USA is excited to highlight these solutions at Dscoop,” says Rick Salinas, president at Duplo USA. “We continue to see migration of many printers to the flexibility and production gains that B2 offers. We are proud to continue our support of this event and to showcase our automated B2 solutions to HP customers for the first time at Dscoop.”
DC-746 B2 Slitter/Cutter/Creaser
Integrating the DC-20K B2 Feeder and DC-20000 B2 Cutter/Bridge Unit with the all-in-one DC-746 Slitter/Cutter/Creaser, the DC-746 B2 expands capabilities to turnaround jobs with better accuracy and efficiency. Process flat sheets with multiple-up impositions into finished pieces that are slit, cut, creased, scored and perforated in a single pass. Get creative with wider formats that stand out from the rest such as oversized direct mailers, accordion brochures, book jackets, posters, and much more.
DSM-1000 B2 Platen Die Cutter
The DSM-1000 B2 Platen Die Cutter produces packaging, POP displays, and pocket folders with incredible precision. It features a user-friendly PC-based operation and performs shape cutting, matrix creasing, perforating, and kiss cutting on sheet sizes up to 20.86” x 29.5” up to 600 gsm. The DSM-1000 also offers a separation unit option for automated stripping and blanking.
Dscoop Edge World Expo will take place May 7-10 at the America’s Center Convention Complex in St. Louis, Missouri.
