Meet Duplo at the Odyssey Expo 2025, where we will showcase our latest die cutting technologies at the Cobb Galleria Centre in Atlanta. The event is part tradeshow, part educational programming and focused on die cutting and die making, print and packaging enhancements, including foil, embossing and UV coatings.
Visit Duplo’s booth to see live demonstrations of our user-friendly and automated equipment. We will have the DSM-1000 B2 Platen Die Cutter on display, ideal for packaging and pocket folder jobs. The UD-310 Rotary Die Cutter will be running high-speed shape cutting applications. Additionally, the DPC-600 PKG Digital Die Cutter will be on exhibit to demonstrate applications on thicker substrates.
Register today and join us at the expo. We can’t wait to see you there!